Development Of An Accelerated Life Testing Method For Reliability Assessment Of Wire Bonded Interconnects Subjected To Mechanical And Electromigratory Stresses

ISBN :
9788188060922

Publisher :
Vishwa Jyoti Press

Subject :
Systems Engineering: Communication, Electrical And Elecronics

Author/Editor :
Ashwini Mujumdar

Language :
English

Edition :
2023

Price (₹) :
9,330.00

Book Details :

Development Of An Accelerated Life Testing Method For Reliability Assessment Of Wire Bonded Interconnects Subjected To Mechanical And Electromigratory Stresses